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1# SPDX-License-Identifier: GPL-2.0-only2#3# Generic thermal drivers configuration4#5 6menuconfig THERMAL7 bool "Thermal drivers"8 help9 Thermal drivers offer a generic mechanism for10 thermal management. Usually it's made up of one or more thermal11 zones and cooling devices.12 Each thermal zone contains its own temperature, trip points,13 and cooling devices.14 All platforms with ACPI or Open Firmware thermal support can use15 this driver.16 If you want this support, you should say Y here.17 18if THERMAL19 20config THERMAL_NETLINK21 bool "Thermal netlink management"22 depends on NET23 help24 The thermal framework has a netlink interface to do thermal25 zones discovery, temperature readings and events such as26 trip point crossed, cooling device update or governor27 change. It is recommended to enable the feature.28 29config THERMAL_STATISTICS30 bool "Thermal state transition statistics"31 help32 Export thermal state transition statistics information through sysfs.33 34 If in doubt, say N.35 36config THERMAL_DEBUGFS37 bool "Thermal subsystem debug support"38 depends on DEBUG_FS39 help40 Say Y to allow the thermal subsystem to collect diagnostic41 information that can be accessed via debugfs.42 43config THERMAL_CORE_TESTING44 tristate "Thermal core testing facility"45 depends on DEBUG_FS46 help47 Say Y to add a debugfs-based thermal core testing facility.48 It allows test thermal zones to be created and populated49 with trip points in order to exercise the thermal core50 functionality in a controlled way.51 52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS53 int "Emergency poweroff delay in milli-seconds"54 default 055 help56 Thermal subsystem will issue a graceful shutdown when57 critical temperatures are reached using orderly_poweroff(). In58 case of failure of an orderly_poweroff(), the thermal emergency59 poweroff kicks in after a delay has elapsed and shuts down the system.60 This config is number of milliseconds to delay before emergency61 poweroff kicks in. Similarly to the critical trip point,62 the delay should be carefully profiled so as to give adequate63 time for orderly_poweroff() to finish on regular execution.64 If set to 0 emergency poweroff will not be supported.65 66 In doubt, leave as 0.67 68config THERMAL_HWMON69 bool70 prompt "Expose thermal sensors as hwmon device"71 depends on HWMON=y || HWMON=THERMAL72 default y73 help74 In case a sensor is registered with the thermal75 framework, this option will also register it76 as a hwmon. The sensor will then have the common77 hwmon sysfs interface.78 79 Say 'Y' here if you want all thermal sensors to80 have hwmon sysfs interface too.81 82config THERMAL_OF83 bool84 prompt "APIs to parse thermal data out of device tree"85 depends on OF86 default y87 help88 This options provides helpers to add the support to89 read and parse thermal data definitions out of the90 device tree blob.91 92 Say 'Y' here if you need to build thermal infrastructure93 based on device tree.94 95choice96 prompt "Default Thermal governor"97 default THERMAL_DEFAULT_GOV_STEP_WISE98 help99 This option sets which thermal governor shall be loaded at100 startup. If in doubt, select 'step_wise'.101 102config THERMAL_DEFAULT_GOV_STEP_WISE103 bool "step_wise"104 select THERMAL_GOV_STEP_WISE105 help106 Use the step_wise governor as default. This throttles the107 devices one step at a time.108 109config THERMAL_DEFAULT_GOV_FAIR_SHARE110 bool "fair_share"111 select THERMAL_GOV_FAIR_SHARE112 help113 Use the fair_share governor as default. This throttles the114 devices based on their 'contribution' to a zone. The115 contribution should be provided through platform data.116 117config THERMAL_DEFAULT_GOV_USER_SPACE118 bool "user_space"119 select THERMAL_GOV_USER_SPACE120 help121 The Userspace governor allows to get trip point crossed122 notification from the kernel via uevents. It is recommended123 to use the netlink interface instead which gives richer124 information about the thermal framework events.125 126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR127 bool "power_allocator"128 depends on THERMAL_GOV_POWER_ALLOCATOR129 help130 Select this if you want to control temperature based on131 system and device power allocation. This governor can only132 operate on cooling devices that implement the power API.133 134config THERMAL_DEFAULT_GOV_BANG_BANG135 bool "bang_bang"136 depends on THERMAL_GOV_BANG_BANG137 help138 Use the bang_bang governor as default. This throttles the139 devices one step at the time, taking into account the trip140 point hysteresis.141 142endchoice143 144config THERMAL_GOV_FAIR_SHARE145 bool "Fair-share thermal governor"146 help147 Enable this to manage platform thermals using fair-share governor.148 149config THERMAL_GOV_STEP_WISE150 bool "Step_wise thermal governor"151 help152 Enable this to manage platform thermals using a simple linear153 governor.154 155config THERMAL_GOV_BANG_BANG156 bool "Bang Bang thermal governor"157 default n158 help159 Enable this to manage platform thermals using bang bang governor.160 161 Say 'Y' here if you want to use two point temperature regulation162 used for fans without throttling. Some fan drivers depend on this163 governor to be enabled (e.g. acerhdf).164 165config THERMAL_GOV_USER_SPACE166 bool "User_space thermal governor"167 help168 Enable this to let the user space manage the platform thermals.169 170config THERMAL_GOV_POWER_ALLOCATOR171 bool "Power allocator thermal governor"172 depends on ENERGY_MODEL173 help174 Enable this to manage platform thermals by dynamically175 allocating and limiting power to devices.176 177config CPU_THERMAL178 bool "Generic cpu cooling support"179 depends on THERMAL_OF180 help181 Enable the CPU cooling features. If the system has no active182 cooling device available, this option allows to use the CPU183 as a cooling device.184 185if CPU_THERMAL186 187config CPU_FREQ_THERMAL188 bool "CPU frequency cooling device"189 depends on CPU_FREQ190 default y191 help192 This implements the generic cpu cooling mechanism through frequency193 reduction. An ACPI version of this already exists194 (drivers/acpi/processor_thermal.c).195 This will be useful for platforms using the generic thermal interface196 and not the ACPI interface.197 198config CPU_IDLE_THERMAL199 bool "CPU idle cooling device"200 depends on IDLE_INJECT201 help202 This implements the CPU cooling mechanism through203 idle injection. This will throttle the CPU by injecting204 idle cycle.205endif206 207config DEVFREQ_THERMAL208 bool "Generic device cooling support"209 depends on PM_DEVFREQ210 depends on PM_OPP211 help212 This implements the generic devfreq cooling mechanism through213 frequency reduction for devices using devfreq.214 215 This will throttle the device by limiting the maximum allowed DVFS216 frequency corresponding to the cooling level.217 218 In order to use the power extensions of the cooling device,219 devfreq should use the simple_ondemand governor.220 221 If you want this support, you should say Y here.222 223config THERMAL_EMULATION224 bool "Thermal emulation mode support"225 help226 Enable this option to make a emul_temp sysfs node in thermal zone227 directory to support temperature emulation. With emulation sysfs node,228 user can manually input temperature and test the different trip229 threshold behaviour for simulation purpose.230 231 WARNING: Be careful while enabling this option on production systems,232 because userland can easily disable the thermal policy by simply233 flooding this sysfs node with low temperature values.234 235config THERMAL_MMIO236 tristate "Generic Thermal MMIO driver"237 depends on OF238 depends on HAS_IOMEM239 help240 This option enables the generic thermal MMIO driver that will use241 memory-mapped reads to get the temperature. Any HW/System that242 allows temperature reading by a single memory-mapped reading, be it243 register or shared memory, is a potential candidate to work with this244 driver.245 246config HISI_THERMAL247 tristate "Hisilicon thermal driver"248 depends on ARCH_HISI || COMPILE_TEST249 depends on HAS_IOMEM250 depends on OF251 default y252 help253 Enable this to plug hisilicon's thermal sensor driver into the Linux254 thermal framework. cpufreq is used as the cooling device to throttle255 CPUs when the passive trip is crossed.256 257config IMX_THERMAL258 tristate "Temperature sensor driver for Freescale i.MX SoCs"259 depends on ARCH_MXC || COMPILE_TEST260 depends on NVMEM || !NVMEM261 depends on MFD_SYSCON262 depends on OF263 help264 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.265 It supports one critical trip point and one passive trip point. The266 cpufreq is used as the cooling device to throttle CPUs when the267 passive trip is crossed.268 269config IMX_SC_THERMAL270 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"271 depends on IMX_SCU272 depends on OF273 help274 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with275 system controller inside, Linux kernel has to communicate with system276 controller via MU (message unit) IPC to get temperature from thermal277 sensor. It supports one critical trip point and one278 passive trip point for each thermal sensor.279 280config IMX8MM_THERMAL281 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"282 depends on ARCH_MXC || COMPILE_TEST283 depends on OF284 help285 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.286 It supports one critical trip point and one passive trip point. The287 cpufreq is used as the cooling device to throttle CPUs when the passive288 trip is crossed.289 290config K3_THERMAL291 tristate "Texas Instruments K3 thermal support"292 depends on ARCH_K3 || COMPILE_TEST293 help294 If you say yes here you get thermal support for the Texas Instruments295 K3 SoC family. The current chip supported is:296 - AM654297 298 This includes temperature reading functionality.299 300config MAX77620_THERMAL301 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"302 depends on MFD_MAX77620303 depends on OF304 help305 Support for die junction temperature warning alarm for Maxim306 Semiconductor PMIC MAX77620 device. Device generates two alarm307 interrupts when PMIC die temperature cross the threshold of308 120 degC and 140 degC.309 310config QORIQ_THERMAL311 tristate "QorIQ Thermal Monitoring Unit"312 depends on THERMAL_OF && HAS_IOMEM313 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST314 select REGMAP_MMIO315 help316 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.317 It supports one critical trip point and one passive trip point. The318 cpufreq is used as the cooling device to throttle CPUs when the319 passive trip is crossed.320 321config SPEAR_THERMAL322 tristate "SPEAr thermal sensor driver"323 depends on PLAT_SPEAR || COMPILE_TEST324 depends on HAS_IOMEM325 depends on OF326 help327 Enable this to plug the SPEAr thermal sensor driver into the Linux328 thermal framework.329 330config SUN8I_THERMAL331 tristate "Allwinner sun8i thermal driver"332 depends on ARCH_SUNXI || COMPILE_TEST333 depends on HAS_IOMEM334 depends on NVMEM335 depends on OF336 depends on RESET_CONTROLLER337 help338 Support for the sun8i thermal sensor driver into the Linux thermal339 framework.340 341 To compile this driver as a module, choose M here: the342 module will be called sun8i-thermal.343 344config ROCKCHIP_THERMAL345 tristate "Rockchip thermal driver"346 depends on ARCH_ROCKCHIP || COMPILE_TEST347 depends on RESET_CONTROLLER348 depends on HAS_IOMEM349 help350 Rockchip thermal driver provides support for Temperature sensor351 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical352 trip point. Cpufreq is used as the cooling device and will throttle353 CPUs when the Temperature crosses the passive trip point.354 355config KIRKWOOD_THERMAL356 tristate "Temperature sensor on Marvell Kirkwood SoCs"357 depends on MACH_KIRKWOOD || COMPILE_TEST358 depends on HAS_IOMEM359 depends on OF360 help361 Support for the Kirkwood thermal sensor driver into the Linux thermal362 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.363 364config DOVE_THERMAL365 tristate "Temperature sensor on Marvell Dove SoCs"366 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST367 depends on HAS_IOMEM368 depends on OF369 help370 Support for the Dove thermal sensor driver in the Linux thermal371 framework.372 373config DB8500_THERMAL374 tristate "DB8500 thermal management"375 depends on MFD_DB8500_PRCMU && OF376 default y377 help378 Adds DB8500 thermal management implementation according to the thermal379 management framework. A thermal zone with several trip points will be380 created. Cooling devices can be bound to the trip points to cool this381 thermal zone if trip points reached.382 383config ARMADA_THERMAL384 tristate "Marvell EBU Armada SoCs thermal management"385 depends on ARCH_MVEBU || COMPILE_TEST386 depends on HAS_IOMEM387 depends on OF388 help389 Enable this option if you want to have support for thermal management390 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).391 392config DA9062_THERMAL393 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"394 depends on MFD_DA9062 || COMPILE_TEST395 depends on OF396 help397 Enable this for the Dialog Semiconductor thermal sensor driver.398 This will report PMIC junction over-temperature for one thermal trip399 zone.400 Compatible with the DA9062 and DA9061 PMICs.401 402menu "Mediatek thermal drivers"403depends on ARCH_MEDIATEK || COMPILE_TEST404source "drivers/thermal/mediatek/Kconfig"405endmenu406 407config AMLOGIC_THERMAL408 tristate "Amlogic Thermal Support"409 default ARCH_MESON410 depends on OF && ARCH_MESON411 help412 If you say yes here you get support for Amlogic Thermal413 for G12 SoC Family.414 415 This driver can also be built as a module. If so, the module will416 be called amlogic_thermal.417 418menu "Intel thermal drivers"419depends on X86 || X86_INTEL_QUARK || COMPILE_TEST420source "drivers/thermal/intel/Kconfig"421endmenu422 423menu "Broadcom thermal drivers"424depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \425 COMPILE_TEST426source "drivers/thermal/broadcom/Kconfig"427endmenu428 429menu "Texas Instruments thermal drivers"430depends on ARCH_HAS_BANDGAP || COMPILE_TEST431depends on HAS_IOMEM432source "drivers/thermal/ti-soc-thermal/Kconfig"433endmenu434 435menu "Samsung thermal drivers"436depends on ARCH_EXYNOS || COMPILE_TEST437source "drivers/thermal/samsung/Kconfig"438endmenu439 440menu "STMicroelectronics thermal drivers"441depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF442source "drivers/thermal/st/Kconfig"443endmenu444 445source "drivers/thermal/renesas/Kconfig"446 447source "drivers/thermal/tegra/Kconfig"448 449config GENERIC_ADC_THERMAL450 tristate "Generic ADC based thermal sensor"451 depends on IIO452 help453 This enabled a thermal sysfs driver for the temperature sensor454 which is connected to the General Purpose ADC. The ADC channel455 is read via IIO framework and the channel information is provided456 to this driver. This driver reports the temperature by reading ADC457 channel and converts it to temperature based on lookup table.458 459menu "Qualcomm thermal drivers"460depends on (ARCH_QCOM && OF) || COMPILE_TEST461source "drivers/thermal/qcom/Kconfig"462endmenu463 464config UNIPHIER_THERMAL465 tristate "Socionext UniPhier thermal driver"466 depends on ARCH_UNIPHIER || COMPILE_TEST467 depends on THERMAL_OF && MFD_SYSCON468 help469 Enable this to plug in UniPhier on-chip PVT thermal driver into the470 thermal framework. The driver supports CPU thermal zone temperature471 reporting and a couple of trip points.472 473config SPRD_THERMAL474 tristate "Temperature sensor on Spreadtrum SoCs"475 depends on ARCH_SPRD || COMPILE_TEST476 help477 Support for the Spreadtrum thermal sensor driver in the Linux thermal478 framework.479 480config KHADAS_MCU_FAN_THERMAL481 tristate "Khadas MCU controller FAN cooling support"482 depends on OF483 depends on MFD_KHADAS_MCU484 select MFD_CORE485 select REGMAP486 help487 If you say yes here you get support for the FAN controlled488 by the Microcontroller found on the Khadas VIM boards.489 490config LOONGSON2_THERMAL491 tristate "Loongson-2 SoC series thermal driver"492 depends on LOONGARCH || COMPILE_TEST493 depends on OF494 help495 Support for Thermal driver found on Loongson-2 SoC series platforms.496 The thermal driver realizes get_temp and set_trips function, which497 are used to obtain the temperature of the current node and set the498 temperature range to trigger the interrupt. When the input temperature499 is higher than the high temperature threshold or lower than the low500 temperature threshold, the interrupt will occur.501 502endif503